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Laser Burn-In Testing

ACBT6208

CoC Burn-In Test System


Built on years of proven burn-in testing expertise, the SEMIGHT ACBT6208 is a high-density, multifunctional, fully automated system designed for laser chip burn-in testing. It delivers significant improvements in material handling efficiency, test performance, system stability, burn-in capacity, and in-process quality monitoring. High-throughput, stable operation supports volume production, rapid line deployment, and efficient production management.
The ACBT6208 features a modular architecture for quick installation, easy maintenance, and fast product changeover. The number of test and burn-in modules per layer can be flexibly configured for different test conditions. Each burn-in slot is independently controlled, enabling parallel burn-in of different products under different test conditions. Product changeover requires only fixture replacement.
The system provides a fully closed-loop workflow and supports a wide range of optional automation modules, significantly reducing manual intervention and associated operational risks. This helps ensure consistency and stability in volume production while enabling integrated equipment management and full-process data traceability.

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  • Key Features
  • Specification

Features

  • Fully Automated Operation

    Integrates automatic fishbone fixture handling, pre-/post-burn-in testing, high-temperature burn-in, bin sorting, and Blue Tape/Gel-Pak handling in a closed-loop workflow, reducing floor space by 50% and labor costs by 80%

  • Modular Architecture

    Supports quick module installation, removal, maintenance, and product changeover
    Multiple CoC products can be accommodated by simply replacing the fixture

  • High-Density Parallel Burn-In

    Temperature range: 25~130 ℃
    Supports up to 7,680 independent drive channels
    High-precision current and voltage control

  • In-Situ Burn-In Power Monitoring

    Optional PD modules support in-situ power monitoring and LIV sweeps, with test repeatability <1%

  • Efficient Temperature Control and Testing

    Supports three-temperature testing from −10°C to 100°C with ±0.5°C temperature control accuracy
    Dual-station platform supports cyclic temperature control and testing, with parallel testing on both sides of each station. Per-CoC test time: LIV + OSA (single current point)

  • Intelligent Automated Loading & Unloading

    Standard CoC ID recognition and automatic sorting at unloading, with an unloading time of <4.5 s per CoC

  • Full-Process Data Traceability

    Unified system monitoring
    Closed-Loop Burn-In, testing, and unloading data
    Eliminates data silos across standalone equipment

Configuration


Specifications

Gen 1 – ACBT6208

Configuration 1

Configuration 2

Modules

Loading/Unloading Unit (set)

1

1

Test Unit (set)

2

4

Burn-In Layer (No. of Layers)

20

16

Fixtures per Burn-In Layer

8

Channels per Driver Board

48 Channels/Board

Current per Channel

1A

Max. Channels

（DML/EML CoC）

0~1A

7680

6144

1~2A

3840

3072

2~3A

2560

2048


1、Loading/Unloading Module


Quantity

Parameter

Specification

Quantity

Parameter

Specification

1

Carrier Type and Quantity

3 Blue Tape/Gel-Pak Carriers

6

Pick-Up Method

Force-Controlled Vacuum Nozzle

5 Fixture Carriers

7

Nozzle Pressure

35±10g

2

Tray Type and Quantity (per Carrier)

5 × 6-inch Blue Tape Trays / 8 × 2-inch Gel-Pak Trays

8

Pick-Up Loss Rate

0.1%

8 Fishbone Fixtures

9

OCR Resolution

5 μm，Color

3

Open Check Before Power-On

Current: 10 mA; Voltage: 1 V

10

CoC Unloading Throughput

4.5s/CoC

4

NG Criteria: >3 Open Devices (Customizable)

11

CoC Placement Accuracy

≤±25 μm

5

Nozzle Capacity

3 Types

12

Angular Placement Repeatability

≤±3°


2、Test Module


Quantity

Parameter

Specification

Quantity

Parameter

Specification

1

TEC

TEC+Water Cooling

11

Standard SMU Options

S2011C & S2019C

2

Heat Sink Temperature Range

-10℃-100℃

12

SMU I/V Measurement Resolution

±3A/100nA, ±6V/1uV

3

Heat Sink Heating/Cooling Rate

20℃/min

13

Ith Repeatability

<±1%

4

Heat Sink Temperature Setting Accuracy

0.1℃

14

Se Repeatability

<±2%

5

Heating/Cooling Time

180 s between any two temperature setpoints

15

Power Repeatability

<±1%

6

Heat Sink Temperature Setting Resolution

0.01℃

16

Vf Repeatability

<±2%

7

Heat Sink No-Load Temperature Uniformity

±1℃

17

Wavelength Repeatability

±0.1 nm

8

Heat Sink Temperature Stability

±0.5 ℃

18

SMSR Repeatability

5dB

9

CoC Temperature Uniformity

±3°C @ 500 mA, 80°C (with high-force probes)

19

Coupled Power@Pout＞25mW

>-15dBm

10

CoC Temperature Stability

±0.5℃@500mA, 80℃（CoC with Built-in NTC）

20

First-Pass Electrical Connection Success Rate

>99.7%


3、Burn-In Module


Quantity

Parameter

Specification

Quantity

Parameter

Specification

1

TEC

TEC+Water Cooling

9

CoC Temperature Uniformity

±3℃@500mA, 80℃（with high-force probes）

2

Heat Sink Temperature Range

25-130℃

10

CoC Temperature Stability

±0.5℃@500mA, 80℃（CoC with Built-in NTC）

3

Heat Sink Heating/Cooling Rate

20℃/min

11

Drive Source Type

Standard Current Source

4

Heat Sink Temperature Setting Accuracy

0.1℃

12

Drive Current Range

0～1000mA

5

Heat Sink Temperature Setting Resolution

0.01℃

13

Drive Current Accuracy

0.3% F.S.±0.07mA

6

Heat Sink No-Load Temperature Uniformity

±1°C (across three heat sink points: both ends and center)

14

Drive Current Stability

48-Hour Current Stability: 

0.3% F.S. ± 0.07 mA

7

Heat Sink Temperature Stability

±0.5°C (worst-case stability across three heat sink points: both ends and center)

15

Current Measurement Resolution

0.07mA

8

Temperature Stabilization Time

300s@80℃

16

Output Current Ripple

＜0.7% F.S Resistive Load


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