The three-day China International Optoelectronic Exposition (CIOE) 2026 successfully concluded at the Shenzhen World Exhibition & Convention Center. Bringing together three major exhibitions, this year’s event connected resources from across the global optoelectronics industry, with a strong focus on high-speed interconnects, AI computing and optoelectronics, chip innovation, and other emerging technologies. It provided an effective platform for technical exchange and industry collaboration.
At Booth 10A69, Semight showcased five core testing zones featuring a comprehensive portfolio of in-house-developed test instruments and production-ready solutions. Designed around the evolving test requirements of the optoelectronics industry, the showcase demonstrated Semight’s commitment to enabling optical and electrical testing in the AI era.01 | Addressing Real-World Test Challenges on SiteThe products and solutions presented at the Semight booth addressed testing requirements across multiple stages of the optoelectronics value chain, from advanced technology research and product development to reliability validation and volume production. Visitors compared different test approaches and exchanged views on technology roadmaps for lasers, silicon photonics, NPO/CPO high-speed interconnects, and other rapidly evolving areas.
Semight’s technical team provided on-site demonstrations and explanations covering instrument performance, test workflows, and solution capabilities. They also addressed frequently raised questions regarding measurement accuracy, application scenarios, production stability, and future system upgrades, helping industry partners and peers gain a clearer understanding of how these technologies can be applied in real-world testing environments.Silicon Photonics & CPO TestingFocusing on emerging optical interconnect architectures including silicon photonics, photonic integrated circuits (PICs), and co-packaged optics (CPO), Semight showcased models from the sCT9002 and OPB8201 series.
A major area of industry partners and peers interest was the performance of the sCT9002 six-axis high-precision positioning and coupling system, together with technical details related to the wafer stage and associated components.1.6T Optical Transceiver TestingFor the development and validation of 1.6T high-speed optical modules, the end-to-end test solution comprising the DCA1065, CR3302, and PBT3058 became one of the key areas of technical discussion.
Industry partners and peers discussions focused primarily on software support for different Preset configurations defined by IEEE specifications, the temperature-control capabilities of the bit-error-rate tester (BERT), and the compatibility of the complete test system with 800G applications.Laser Chip TestingThe Laser Chip Testing zone also featured a physical CoC burn-in fixture. Engineers discussed technical considerations including compatibility with different chip package formats, ease of installation and removal, and the test functions supported by the complete system.
Electronic MeasurementThe PXIe dynamic test system and the S2036H high-precision benchtop source measure unit (SMU) were featured in this zone, demonstrating precision measurement and dynamic testing capabilities for both optoelectronic device R&D and volume production.
Key areas of interest included multi-channel parallel testing performance, hardware synchronization requirements for external equipment, and pA-level measurement of laser-chip monitor photodiode current.50G PON Testing50G PON testing was another major topic of discussion. Industry partners and peers inquiries focused on practical requirements including data-rate compatibility, jitter injection, multi-channel output, and functional configuration.
In addition to the five core testing zones, an exclusive preview of new high-speed signal testing products attracted a number of industry partners and peers by appointment. Semight engineers held one-on-one technical discussions with invited partners, exploring practical testing requirements in advanced R&D, technology iteration, and production-scale upgrades.02 | Sharing Semight’s Technology Roadmap Across Multiple ChannelsThroughout the exhibition, Semight engaged with the industry through both online and on-site channels. Product demonstration videos filmed at the booth provided a direct view of the company’s core test solutions and technical capabilities. Semight also participated in interviews with leading industry media, sharing perspectives on emerging technologies, market trends, and industry development while further strengthening technical exchange across the ecosystem.03 | Turning Frontline Feedback into Practical Industry InsightCIOE 2026 provided a comprehensive showcase of Semight’s full-stack testing capabilities for optical communications.
The event also gave our team deeper insight into the real-world requirements of partners in high-speed optical interconnect and optoelectronic testing. Looking ahead to key technology areas including silicon photonics, CPO, ultra-high-speed optical interconnects, and next-generation broadband networks, Semight will continue to strengthen in-house R&D and product development. We will further enhance our test capabilities across R&D validation, engineering testing, and volume production, while continuously improving the completeness and adaptability of our solutions.Connecting Through Technology, Advancing TogetherOur sincere thanks to every industry professional and partner who visited Booth 10A69 to exchange ideas and share valuable insights with us.
With years of experience in test and measurement, Semight has built strong technical expertise not only in high-speed optical communications testing, but also in semiconductor chip testing. This October, the Greater Bay Area Semiconductor Industry Ecosystem Expo will take place at the Shenzhen Convention & Exhibition Center (Futian), where Semight will exhibit at Booth 9E02.We look forward to meeting both new and long-standing partners again and to supporting continued innovation and advancement across the optical communications and semiconductor industries through professional test and measurement technologies.
Date:2026.09.14
Visits:12
