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Known Good Die

PB6400

SiC KGD Die Handler


Semight PB6400 KGD Die Handler can be mainly used for power chip Die-level dynamic and static test to implement the screening of chip performance indicators and improve the first pass yield of the module after packaging. The testers in the corresponding specifications can be configured by test items, test conditions and test parameters. According to customer requirements, can supports the customized development. The system supports a variety of chip packaging methods, such as blue tap, Waffle Pack and Tape &Reel.



Features

  • Excellent Scalability

    Modular design with loading
    unloading and test stations
  • Dynamic, Static and UIS Tests

    Static test 2000V/200A
    Dynamic test 2000V/1500A
  • Multi-site Parallel Testing

    Supports up to four independent test sites, each configurable with unique test conditions and parameters
  • Precision Temperature Control

    Room temperature ~ 185 ℃,
    accuracy<±3°C, resolution: 0.1°C
  • Airtight Socket Design

    Supports nitrogen gas for arcing protection with integrated pressure monitoring
  • 6s AOI

    Micro-scale visible defect inspection down to 12µm
  • High Throughput

    Up to 900 UPH @ 1s test time for Known Good Die
  • Powerful Software

    Supports data MAP and bin sorting
    Enables local storage, database uploads, and EAP integration
    Offers tiered permissions and multi-account management


Category

Parameter

Specification

Remark

Basic Parameters Die Size 3*3mm-8*8mm

Die Thickness100-400μm

P&P Accuracy ±30μm
Temperature System

Temperature Range



Room Temperature ~185℃

Resolution 0.1℃
Tolerance ≤±3℃

Vision Inspection
System
Inspection Accuracy
≥12μm
Grayscale contrast ratio > 40
Defect Top/Bottom: 
Scratch, Dirt, 
Contamination, 
Burn Mark, 
Chipped, Defect

Side: Chipped

Stability 
MTBF 
>168H 

MTBA
>2H 

MTTA
5 min 

MTTR 
<30 min 

Drop Rate
 ≤0.01% 
Due to P&P
Fragmentation Rate≤0.01%

Probe Depth
≤2μm

Drain Kelvin  
≤2Ω
TiNiAg material 
Efficiency Single Die
≥500 UPH 
Test time ≤1s 
Dual Die
≥900 UPH 
Test time ≤1s 

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