PB6800 KGD Die Handler-Semight Instruments

Features

Excellent Scalability
Modular design with loading, unloading, and multiple test stations
Six-Channel Parallel Testing
Supports up to 2 temperature zones for testing
Different test stations support varying test conditions and items
Dynamic, Static, and UIS Tests
Static test 2000 V/ 600 A
Dynamic test 1200 V/ 2000 A
Modular Unloading Design
Supports unloading in wafer / wafer + tape & reel / wafer + auto tray configurations
Precise Temperature Control
Range: RT ~ 200°C,
accuracy: ±3°C,
resolution: 0.1°C
Airtight Socket Design
Prevents high-voltage arcing
through nitrogen protection
and air pressure monitoring
Efficient Multi-station
Up to 6 test stations
with a test time of 0.7s
and UPH > 4000
Good Maintainability
Supports automatic socket replacement in case of die failure,
improving equipment uptime

Category	Parameter	Specification
Basic Parameters	Type	SiC, IGBT
	UPH	Up to 4700, including input and output
	Loader	Wafer, Auto Tray, Tape
	Unloader	Wafer / Wafer + Auto Tray / Wafer + Tape&Reel
Temperature Control	Temperature Range	Up to 200°C
Temperature Control	Tolerance	≤±3°C
Vision Inspection System	Station	Up to 6
	Stray Inductance	≤40 nH
	Retrofit Kit	Socket
	Die Size	2.52.5 mm-88 mm
	Die Thickness	100 µm- 400 µm
	P&P Accuracy	±30 µm
	Unloader	Wafer / Wafer +Auto Tray / Wafer+Tape&Reel
	Socket Replacement	Auto
	Socket Cleaning	Auto
	AOI	6
	AOI Accuracy	≥12 µm
	Defect Inspection	Frontside / Backside: Scratches, Stains, Foreign Material, Cracks, Unfilled Corners, and Chipping. Side: Edge Chipping
Stability	MTBF	>168H
	MTBA	>2H
	MTTA	<5 min
	MTTR	<30 min
	Drop Rate	≤0.01%
	Fragmentation Rate	≤0.01%
	Probe Depth	≤2 µm
	Drain Kelvin	≤2 Ω

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