Features

Pulse Width
Minimum 3μs, maximum 500μs
Suitable for faster tested devices to better avoid the impact of temperature on test results
High-speed Measurement
ADC up to 125MSa/s
High Range
Range: ±2A, 10V
Stronger Load Adaptability
Test loads with different characteristics to ensure that the waveform does not experience overshoot or other distortions
High Speed Synchronization
Single-channel and multi-mode collaborative measurement
Real Time Reading of DUT Voltage Drop for Pulse Current
No additional equipment required, precise monitoring of current testing conditions, real-time reading back of test results

Functions and Advantages

Working conditions
Temperature 23 ℃± 5 ℃
Relative humidity<70%

Pulse Current Output

Parameter	Specification
Current Accuracy	Range	Programming Resolution	Accuracy^[1](1Y) ±(%RD+Offset)	Typical Noise^[3](RMS) 1Hz-10MHz
	±150mA^[2]	20μA	0.1%+0.2mA	0.2mA
	±750mA	20μA	0.1%+0.3mA	0.3mA
	±2A	40μA	0.1%+2mA	0.4mA
Maximum Load Voltage Drop	10V
Pulse Width Resolution	80ns
Maximal Pulse Width T_on-max	500μs
Minimal Pulse Width T_on-min	3μs
Pulse Minimal Cut-off Time T_off-min	100μs
Pulse Width Accuracy	100ns^[4]
Pulse Period Jitter	500ns(Typical)
Rising Time (10%-90%)	＜400ns^[4][5][6]
Pulse Overshoot	＜3%^[4][5][6]
Current Regulation Rate	Line Regulation	0.05% of Range
	Load Regulation	±100μA
Duty Cycle Limitation^[7]	D≤50%, where: D < 3/[(Vsp - Vload)x(\|Iset\|- \|Ibias\|)]
Maximum Number of Pulses per Scan	65535

[1]Test Setup:current pulse width 500us, use of high accuracy ammeter,measurement speed 0.02 NPLC;

[2]Switched internally, user setting not required;

[3]Use of 10Ω resistance load, measure noise of two terminals,calculated by I=V/R;

[4]Bias current>1mA, pulse width measured from 10 of rising edge 10% to 90% of failing edge 90%;

[5]Load: 0.5Ω resistor;

[6]Total inductance of output lineand DUT＜200nH(100k);

[7] Iset:setting current;Ibias:bias current; D:duty cycle;Vsp:programmed source voltage from 5-40V;Vload:voltage drop of load;

Note:In current output mode, the instrument will automatically detect the circuit loop state. In case of external circuit open, it will shut down the output and report error.

Pulse Measurement (both Voltage and Current)

Parameter	Specification
Pulse Voltage Measurement	Range	Display Resolution	Accuracy ±(%RD+Offset)
	6V	1mV	0.1%+22mV
	10V	10mV	0.1%+24mV
Pulse Current Measurement	Range	Display Resolution	Accuracy ±(%RD+Offset)
	150mA	100μA	0.1%+1mA
	750mA	100μA	0.1%+3mA
	2A	1000μA	0.1%+15mA
Sense Constrain(PULSE VM)	Max Votlage between HI and SENSE HI =±10V; Max Voltage between LO and SENSE LO =±10V;

Bias Current

Parameter	Specification
Current Accuracy	Range	Max Current	Programming Resolution	Accuracy ±(%RD+Offset)	Typical Noise^[3](RMS)1Hz-10MHz
	±0.15A	50mA	20μA	0.1%+0.2mA	0.2mA
	±0.75A		20μA
	±2A		40μA

Trig Signal

Trig Source	Trig Function	Level	Delay^[8](Typical^[9])	Trig Mode
PXI0-PXI7	Trig_IN^[10]	/	500ns	Rising/Falling/Dual Edge
PXI0-PXI7	Trig_OUT^[11]	/	300ns	Rising Edge
DIO^[12]	Trig_IN	5V	500ns	Rising/Falling/Dual Edge
DIO	Trig_OUT	5V	300ns	Rising Edge

[8]The delay between trig signal and current pulse;

[9]Test setup:output current＞100mA,bias current＞1mA;

[10]Trig_In(slave);

[11]Trig_Out(master);

[12]Max input voltage 5V,min input voltage 0V,VOL 1.5V,VOH 3.5V,max output/input current 2mA.

Similar recommendation

High Speed Communication Test

High speed communication test plays an important role in the rapid development of big data, cloud computing, 5G communication and other markets.
Semight offers various of instruments for optical Transceiver/Component testing, including wide bandwidth sampling oscilloscope, NRZ/PAM4 bit error ratio tester , burst error ratio tester, fast wavelength meter, high precise source measure unit, 400G network analyzer ,optical power meter, optical attenuator, optical switch etc. We provide cost-effective, complete solutions for optical testing.

Details

Electronic Measurement

The high-precision source measure units integrates the functions of voltage source, current source, voltmeter, ampere meter, and electronic load in one, which is widely used in high-precision IV test and measurement for various discrete components, photovoltaic, green energy, battery and other industries. Semight provides high-precision benchtop SMU and plug-in PXIe SMU of standard PXIe chassis, fully meeting the application of various test scenarios.

Details

Optical Chip Test

Burn-in testing of laser is an important method to ensure the reliability of laser. Through the test of CoC or bare die, the early failure of laser caused by the defects in the process of laser production can be screened out in advance. Semight provides a complete solution from bare die to CoC, from high temperature(150℃ or higher) to low temperature (-40℃), with CoC automatic loading and unloading system, forming a complete test solution, Semight's laser chip burn-in/load/unload test system has been widely recognized by the market.

Details

Power Semiconductor Test

The semiconductor front-end test is mainly used in the wafer processing to check whether the processing parameters of the wafer products meet the design requirements or there are defects affecting the yield after each step of the manufacturing process. The semiconductor back-end test equipment is mainly used after wafer processing to check whether the performance of the chip meets the requirements, which belongs to the electrical performance test. Semight provides solutions such as Wafer Level Burn In system and Known Good Die handler for SiC testing, offering the value to customer in test efficiency improvement and test cost reduction.

Details

Site Map

Pulse Current Output

Pulse Measurement (both Voltage and Current)

Bias Current

Trig Signal