Features

Automatic/Semi-automatic
Supports automatic and semi-automatic wafer loading and unloading
Wafer Size
Supports 8-inch and 6-inch wafers
Test Temperature
Supports the test temperature range from room temperature to 150 ℃ (other temperatures can be customized)
Test Function
Supports optical-optical test, photoelectric test and electrical parameter test
DC/AC
Supports DC and AC test
Grating Vertical Coupling
Grating coupling, FA coupling, and edge coupling
High Efficiency
For different types of chips, supports rapid replacement of different types of pin cards
Software Function
The software supports the addition of customer database and MES functions

Functions and Avantages

High Accuracy Probe Station

Wafer loading mode supports fully automatic mode and semi-automatic mode operation, which is suitable for laboratory verification and mass production.
The fully closed-loop high-accuracy motion control system is provided with automatic accuracy compensation function and its positioning accuracy is up to 3μm.
The special mechanism design and calibration system can make the wafer on chuck have better planarity and better perpendicularity in Z direction of probe.
A high-definition zooming CCD configured on the system can make the power on PAD clearly visible and display low-magnification and high-magnification multi-view screens at the same time.
The built-in integrated shock-proof design is adopted which can isolate the external vibration and ensure a good test stability.
Coupling Test Module

The coupling test module includes coupling optical probe, DC probe and RF probe.
The optical probe supports single-channel coupling and dual-channel coupling.
The optical probe is provided with a high-precision altimeter to ensure the consistency of the height from the incident fiber end face to the chip surface between different chips.
The optical fiber coupling module is composed of a three-dimensional lead screw motor matched with a three-dimensional high-precision piezoelectric ceramic module to ensure the optical coupling efficiency and the optical coupling repeatability.
The standard high-precision coupling controller configured on the system which can help the system realize the functions of fully closed-loop control and hardware synchronization improve the coupling accuracy and coupling speed.
The design of the probe card holder is more convenient for the replacement of the probe card, which is convenient to quickly replace the probe card for different products or different test items.

Specification

CHUCK	Platform	Material	Cast iron
	Chuck X&Y Axis	Motor type	Servo motor
		Travel range X*Y	≥240 mm * 340 mm
		Resolution	0.1 μm
		Positioning accuracy	±2 μm
		Max speed	200 mm/s
	Chuck Z Axis	Motor type	Stepper motor
		Travel range	≥30 mm
		Resolution	0.2 μm
		Positioning accuracy	±2 μm
		Max speed	30 mm/s
	Chuck θ Axis	Motor type	Stepper motor
		Travel range	±8°
		Resolution	0.001°

Coupled Module	Motion and positioning	Hexapods + Piezo	6 serial axis +Piezo
	Max number of active axes	9	9
	Rotation for roll, yaw and pitch	Automated	Automated
	Stepping for X, Y, Z	Automated	Automated
	Rough Positioning
	Travel range X,Y,Z	±17, ±15, ±7 mm	±15, ±15, ±10 mm
	Travel range θX, θY, θZ	±9, ±8.5, ±18°	±6, ±5, ±6°
	Minimum incremental motion X, Y, Z	±0.10, ±0.10, ±0.05 μm	±0.10, ±0.10, ±0.10 μm
	Minimum incremental motion θx, θy, θz	0.05mdeg, 0.05mdeg, 0.1mdeg	0.01deg, 0.01deg, 0.01deg
	Fine Positioning
	Travel range in X, Y, Z, closed loop	80 μm
	Min. incremental motion, open-loop	0.4 nm
	Min. incremental motion, closed-loop	4 nm
	Alignment Speed
	Scanning time of spiraled area scan	<1.5 s
Note	For vertical coupling only, purchasing the 8-axis system is sufficient. To be compatible with both vertical and edge coupling, the 9-axis system is required

Coupling Specification	Optical coupling speed	<1.5s @ unilateral coupling
	Coupling repeatability	<0.2 dB (30 times）
	Optical power stability	<0.2 dB@5 min

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