Features

Automatic/Semi-automatic
Supports automatic and semi-automatic wafer loading and unloading
Compatible with 12-inch and 8-inch wafers
Wafer thickness 200μm - 2000μm
Edge Coupling
Real-time monitoring of height using nano displacement sensors to reduce the risk of damaging optical fibers
High-precision vision system, reducing errors caused by small angles
Vertical Coupling
Alignment of wafer level grating couplers using vertical coupling method
Supports spiral scanning and gradient scanning (coupling time <1.5 s)
Automated Fiber Calibration
Automated calibration script, angle calibration of the fiber array can be completed within 3mins
Modular Platform Software
Supports Notch Up/Down continuous testing, no need to reload wafer, saving testing time
Integrates most of the current silicon photonic wafer testing items cover O/O, E/E and O/E testing
Self-developed SMU
High-precision 12-channel card-type SMU, high integration, saving machine space
±10 V, 50mA, the range perfectly covers the silicon light testing requirements
Equipped with a Height Sensor
Solves the flatness variation issue of the wafer on the chuck
Test Temperature Range
Room temperature 25°~150°
(other temperatures can be customized)

Functions and Avantages

System Architecture

sCT9002 SiPh Wafer Test System can achieve automated wafer loading. The loaded wafers can be rotated and positioned on the stage and the testing temperature can be adjusted according to testing requirements. The active optical alignment system and electrical probes couple/connect the optoelectronic signals to the testing instruments, completing the wafer testing.
Automatic Wafer Handling

The wafer loading mode can choose between fully automatic mode or semi-automatic mode. The semi-automatic mode is suitable for laboratory verification to save investment costs; the fully automatic mode is suitable for large-scale mass production to improve production efficiency.

Specification

CHUCK	Platform	Material	Cast iron
	Chuck X&Y Axis	Motor type	Servo motor
		Travel range X*Y	≥340 mm * 490 mm
		Resolution	0.1 μm
		Positioning accuracy	±2 μm
		Max speed	300 mm/s
	Chuck Z Axis	Motor type	Stepper motor
		Travel range	80 mm
		Resolution	0.2 μm
		Positioning accuracy	±2 μm
		Max speed	30 mm/s
	Chuck θ Axis	Motor type	Stepper motor
		Travel range	±5°
		Resolution	0.0000191°

Coupled Module	Motion and positioning	Hexapods + Piezo	6 serial axis +Piezo
	Max number of active axes	9	9
	Rotation for roll, yaw and pitch	Automated	Automated
	Stepping for X, Y, Z	Automated	Automated
	Rough Positioning
	Travel range X,Y,Z	±17, ±15, ±7 mm	±15, ±15, ±10 mm
	Travel range θX, θY, θZ	±9, ±8.5, ±18°	±6, ±5, ±6°
	Minimum incremental motion X, Y, Z	±0.10, ±0.10, ±0.05 μm	±0.10, ±0.10, ±0.10 μm
	Minimum incremental motion θx, θy, θz	0.05mdeg, 0.05mdeg, 0.1mdeg	0.01deg, 0.01deg, 0.01deg
	Fine Positioning
	Travel range in X, Y, Z, closed loop	80 μm
	Min. incremental motion, open-loop	0.4 nm
	Min. incremental motion, closed-loop	4 nm
	Alignment Speed
	Scanning time of spiraled area scan	<1.5 s
Note	For vertical coupling only, purchasing the 8-axis system is sufficient. To be compatible with both vertical and edge coupling, the 9-axis system is required

Coupling Specification	Optical coupling speed	<1.5 s @ unilateral coupling
	Coupling repeatability	<0.2 dB (30 times）
	Optical power stability	<0.2 dB @ 5 min

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