Wafer Level Burn-In
WLBI3810
Wafer Level Burn-in System
Semight WLBI3810 Wafer Level Burn-In System is a high-end burn-in test equipment specifically designed for SiC and GaN wafers, featuring efficient and precise testing capabilities. This system can simultaneously perform High-Temperature Gate Bias (HTGB) and High-Temperature Reverse Bias (HTRB) burn-in tests on 9 wafers, with a testing time range from several minutes to thousands of hours, flexibly adapting to the burn-in requirements of different products. This equipment features a fully
automated loading and unloading system, incorporates a three-cassette design,
supports seamless test mode switching, and automatically adjusts burn-in
conditions, ensuring both efficiency and continuity throughout the testing
process.
The system is capable of high-precision detection of the threshold voltage (Vth) for each die, ensuring the accuracy of test data. Each test channel is equipped with an independent over-current protection function, effectively safeguarding the safety of the devices under test. Additionally, the system can generate detailed map data, providing users with comprehensive performance analysis and quality control references. The WLBI3810 system provides
reliable solutions for diverse testing needs, from stable burn-in tests in
large-scale batch production to flexible configuration in R&D.
Features
Automated Loading and Unloading
Fully automated wafer handling minimizes manual intervention, boosting efficiency and accuracy
Precise Probing
Delivers ±25μm probe mark repositioning accuracy for reliable testing
Comprehensive System Features
Supports map data binding for traceability and testing up to 2560 dies simultaneously
Multimode Burn-in
Automatically switches between HTGB and HTRB modes
Leakage Current Monitoring
Igss and Idss leakage current moitoring
Integrated Testing Functions
Includes Vth parameter testing for in-depth analysis
Exceptional Measurement Accuracy
Offers maximum resolution of 0.1nA
Precise Temperature Control
Ensures uniformity within ±2℃@ TR~175℃, accuracy within 1℃, and resolution of 0.1℃Functions and Advantages
System Configuration
The system accommodates up to nine burn-in stations, each dedicated to a single wafer and independently controlled. This design enables multiple stations to operate in different modes simultaneously, and supports various burn-in verifications by running the burn-in plan.
|
No. |
Model |
Description |
Specification |
|
1 |
Wafer Level Burn-in System Loader |
WLBI3810-AL |
- Supports fully automatic wafer loading and unloading - Can be adapted to SMIF docking with customer's overhead transport system - Automatically obtains wafer status within cassette - Wafer ID reading - Wafer flattening |
|
2 |
Wafer Level Burn-in System Handler 1 |
WLBI3810-H1 |
- Implement wafer transfer between the loader and burn-in machine layers 1-3 |
|
3 |
Wafer Level Burn-in System Handler 2 |
WLBI3810-H2 |
- Implement wafer transfer between the loader and burn-in machine layers 4-9 |
|
4 |
Wafer Level Burn-in System Burn-in Chamber |
WLBI3810-M |
- Includes burn-in system cabinets and their automation parts. - 6&8 inch wafers - Temperature RT～175℃ - Temperature uniformity ≤±2℃, accuracy ≤1℃, resolution 0.1℃ - Supports pin mark repeatability ≤ ±25μm - Supports nitrogen protection to prevent high-voltage arcing and Pad oxidation Note: HTGB+HTRB: Full configuration with 9 stations |
|
5 |
Wafer Level Burn-in System Single Layer |
WLBI3810-L |
- High-precision leakage current testing, with leakage current resolution up to 0.1nA - Supports Map data binding for traceable data - HTGB and HTRB automatically switchable, with negative voltage applied to the Gate during RB aging - Igss and Idss leakage configuration can be scanned - Integrated Vth parameter testing - Flexible configuration of burn-in plans - Support for SECS/GEM communication interface - Software supports local data and database upload, and supports EAP integration - Supports CP MAP data import - Supports online editing of test Recipe - Software supports three-level permission management and multi-account management - 1 year free maintenance Note: HTGB+HTRB fully configured with 9 workstations |
|
6 |
Wafer Level Burn-in System Fixture |
WLBI3810-F |
- Supports 6&8 inch wafers - For SiC wafer aging: HTGB+HTRB - Fixture maximum withstand voltage 2000V (maximum withstand voltage may be affected by individual die size) - Full Touch, aging all Die at once, up to 2112 Die (2560 Die requires customization) |
Similar recommendation
High speed communication test plays an important role in the rapid development of big data, cloud computing, 5G communication and other markets.
Semight offers various of instruments for optical Transceiver/Component testing, including wide bandwidth sampling oscilloscope, NRZ/PAM4 bit error ratio tester , burst error ratio tester, fast wavelength meter, high precise source measure unit, 400G network analyzer ,optical power meter, optical attenuator, optical switch etc. We provide cost-effective, complete solutions for optical testing.
The high-precision source measure units integrates the functions of voltage source, current source, voltmeter, ampere meter, and electronic load in one, which is widely used in high-precision IV test and measurement for various discrete components, photovoltaic, green energy, battery and other industries. Semight provides high-precision benchtop SMU and plug-in PXIe SMU of standard PXIe chassis, fully meeting the application of various test scenarios.
Details
Burn-in testing of laser is an important method to ensure the reliability of laser. Through the test of CoC or bare die, the early failure of laser caused by the defects in the process of laser production can be screened out in advance. Semight provides a complete solution from bare die to CoC, from high temperature(150℃ or higher) to low temperature (-40℃), with CoC automatic loading and unloading system, forming a complete test solution, Semight's laser chip burn-in/load/unload test system has been widely recognized by the market.
Details
The semiconductor front-end test is mainly used in the wafer processing to check whether the processing parameters of the wafer products meet the design requirements or there are defects affecting the yield after each step of the manufacturing process. The semiconductor back-end test equipment is mainly used after wafer processing to check whether the performance of the chip meets the requirements, which belongs to the electrical performance test. Semight provides solutions such as Wafer Level Burn In system and Known Good Die handler for SiC testing, offering the value to customer in test efficiency improvement and test cost reduction.
DetailsFollow
Name
E-mail verfication code
Phone
Password
Confirm Password
E-mail address
E-mail verification code
New Password
Confirm Password
Ask for demo
