Date:2026.03.18
Visits:307
The semiconductor testing, automotive electronics, and passive component industries are undergoing the same transformation: test frequencies are rising to the MHz range, and bias voltages are gradually exceeding 40 V. At the same time, there is a growing demand for continuous improvements in single-station testing efficiency.
Traditional benchtop LCR meters face a dilemma in production line deployment: adding instruments preserves efficiency but overfills test cabinets; reducing channels saves space but lowers throughput. Market demand for impedance testing is shifting from “standalone instrument performance” to “system-level density”.
The advantages of modular instruments based on the PXIe architecture are now fully evident. Full-bandwidth coverage from 20 Hz to 2 MHz with 5-digit resolution, 0.05% basic accuracy, and ±40 V built-in bias are all packed into a dual-slot 3U module. This solution eliminates the need for external bias sources and removes the trade-off between accuracy and channel count. A single 18-slot chassis can scale up to eight Z4001C modules, supporting multi-module trigger synchronization or hybrid integration with modules such as PXIe SMUs, thereby directly increasing parallel test throughput.
02、Product Benefits
0.05% basic accuracy ensures reliable measurements across both high and low impedance ranges.
5-digit resolution across the full 20 Hz to 2 MHz range, supporting full-band characteristic sweeps.
Built-in ±40 V DC bias eliminates the need for external bias sources and cables, simplifying system complexity and preventing noise introduction.
1 million data points for high-volume sweep, enabling rapid construction of 3D device impedance-frequency-bias characteristic maps.
Based on the PXIe protocol, it supports multi‑module synchronous triggering or parallel testing; a single chassis can accommodate up to eight Z4001C modules.
Can be combined with other PXIe instruments, such as PXIe SMUs, to build multifunctional test systems.
Controlled via standard SCPI commands, it provides programming interfaces for C#, Python, C/C++ and LabVIEW, significantly simplifying software integration into test systems.

In wafer-level parameter testing, CV/IV characteristic extraction and process parameter monitoring must be performed on every die on the wafer; MEMS and Integrated Passive Devices (IPDs) require precise capacitance and resonance characterization for micro‑sensors. The high-density PXIe LCR solution integrates multiple modules within a single chassis and, when used in conjunction with a switch matrix, enables fully automated testing.
Multi-layer Ceramic Capacitor (MLCC) production lines require simultaneous verification of capacitance, dissipation factor, and voltage bias characteristics at high throughput. Inductors and passive filters face production pressures for multi-station parallel testing of inductance and Q factor. Multi-channel high-density solutions directly improve production line cycle times and significantly reduce test costs per unit.
Characterization of power inductors and varactor diodes requires a sweep across various frequencies and under high DC bias voltages of ±40 V. In materials research, a high-resolution sweep with up to 1 million data points is often required to generate complete characteristic curves. Built-in high-voltage bias and massive sweep capability support in-depth analysis, while the modular architecture enables easy integration of various instruments to flexibly build hybrid test systems.
04、Semight Instruments
We understand that using such high-precision instruments requires a certain level of expertise. Therefore, we provide:
Built-in test algorithms for common semiconductor devices to reduce your setup time.
Step-by-step guidance and data analysis recommendations for common measurement scenarios and issues.
Semight application engineering team stands ready to answer your specific questions regarding measurement configuration and data analysis.

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