On August 21–22, the 3rd International Power Device Manufacturing, Testing & Application Conference (IPF 2025) was held in Wuxi. Semight made its debut at the event, showcasing a portfolio of chip testing solutions and delivering a keynote presentation.

🚗 Keynote: Achieving Automotive-Grade SiC Reliability

Semight’s Marketing Director delivered a technical presentation titled, "Achieving Automotive-Grade Reliability: SiC Testing Solutions from Lab to Fab".

The speech highlighted that the widespread adoption of silicon carbide (SiC) power devices in electric vehicles is pushing semiconductor testing into high-voltage, high-current, and high-temperature environments. This presents manufacturers with multiple challenges, including:

• Ensuring long-term device reliability and functional integrity.
• Addressing yield risks during dicing, packaging, and assembly.
• Simultaneously scaling production capacity.

To meet these demands, Semight offers an integrated "lab to fab" testing system covering the entire SiC device lifecycle. This comprehensive solution enhances both on-wafer and post-assembly yield by empowering customers to accelerate product validation, reduce defect leakage, and lower R&D costs.

💡 Booth Spotlight: High-Precision Test Solutions

At its booth, Semight demonstrated high-precision, high-efficiency testing solutions, with technical staff providing one-on-one explanations of core features and applications.

Numerous industry clients discussed the innovations with Semight's experts, expressing strong interest in the performance metrics of newly launched products:

• WLBI3810 Wafer-Level Burn-In System: Featuring 9-layer burn-in capability.
• WAT Parametric Test System: Offering 1fA (femtoampere) resolution.
• KGD Test and Sorting System: Highlighting its UPH (Units Per Hour) capacity and dynamic/static testing capabilities.

📈 Conference Takeaways and Future Commitment

Through systematic learning and in-depth exchanges with industry peers, Semight gained valuable insights. The team developed a clearer understanding of dynamic testing standards and dissected key requirements of the AQG-324 standard. This work yielded more precise threshold voltage drift data and helped verify SiC device failure modes, a critical step in ensuring automotive-grade reliability for mass production.

As China’s wide-bandgap semiconductor industry (SiC and GaN) thrives and ultra-wide-bandgap materials emerge, Semight is committed to being an industry pioneer. The company will further increase R&D investment, deepening its expertise in testing technologies for SiC, GaN, and other advanced materials to contribute to innovation in the industry